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Ultimate Reliability in Extreme Environments

DDR3 and DDR4 memory qualified from -40°C to 105°C. Every die physically tested. Full design ownership, no outsourced qualification chain.

Extreme close-up of a DDR3 memory module, gold contact fingers and black PCB substrate in sharp focus under studio strobe lighting, cool white background, clinical framing revealing trace geometry and IC markings
Extreme close-up of a DDR3 memory module, gold contact fingers and black PCB substrate in sharp focus under studio strobe lighting, cool white background, clinical framing revealing trace geometry and IC markings
Extreme close-up of a DDR4 memory module, fine-pitch gold fingers and dense BGA component arrangement on dark PCB, studio strobe raking light revealing solder mask texture and component placement precision, cool white background, no warm tones
Extreme close-up of a DDR4 memory module, fine-pitch gold fingers and dense BGA component arrangement on dark PCB, studio strobe raking light revealing solder mask texture and component placement precision, cool white background, no warm tones

Wide-Temperature Memory Solutions

Wide-Temp DDR3L

Wide-Temp DDR4

Industrial-grade DDR3 qualified across the full -40°C to 105°C envelope. 100% tested, PSMC wafer origin, FATC packaged.

High-bandwidth DDR4 for demanding platforms: automotive, AI server, and defense applications where temperature tolerance is non-negotiable.

Operating Range: -40°C to 105°C | Fab: PSMC | Pkg: FATC

Operating Range: -40°C to 105°C | Fab: PSMC | Pkg: FATC

Wide shot of a semiconductor wafer probe station in an industrial cleanroom, overhead view of a 300mm wafer on a precision chuck under test needles, cool fluorescent lighting, clinical white environment, sharp technical detail, no human figures
Wide shot of a semiconductor wafer probe station in an industrial cleanroom, overhead view of a 300mm wafer on a precision chuck under test needles, cool fluorescent lighting, clinical white environment, sharp technical detail, no human figures

Control at Every Stage

Top-Tier Supply Chain

Wafer processing by PSMC, packaging and testing by FATC. Direct fab relationships — no intermediary, no opacity.

Proven Extreme Tolerance

100% physically tested from -40°C to 105°C. Not sampled — every single die, no exceptions.

Custom OEM Branding

Wafer and package shipped logo-free by default. Custom brand printing available on request — your mark, your supply chain.

Independent R&D

In-house design and tape-out. Tier-1 fab manufacturing. Zero tech bottlenecks — the roadmap is ours, not a licensee's.

Uncompromising Quality

100% wide-temperature full inspection. Stringent outgoing quality control. Auditable at every step.

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Ready to Qualify for Your BOM?

Request samples or a formal quote. Full test data available. OEM branding options confirmed at order stage.

MemCore

Tested every die.

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