Full Qualification. Both Families. Every Die.
Wide-Temp DDR3 and DDR4 — both designed in-house, taped out at Tier-1 fabs, and 100% tested across -40°C to 105°C. Specifications you control, supply chain you can audit.
DDR3 and DDR4 — Spec to Spec
Wide-Temp DDR3
Temperature range: -40°C to 105°C. 100% physically tested per die. Speeds from 1333 to 1866 Mbps. Capacities: 4 Gb AND 8 Gb.
Wafer processed at PSMC. Package and test by FATC. In-house tape-out; zero dependency on third-party IP roadmaps.
Wide-Temp DDR4
Temperature range: -40°C to 105°C. 100% physically tested per die. Speeds from 2133 to 3200 MT/s. Capacities: 4 Gb to 16 Gb.
Same vertically integrated supply chain as DDR3. PSMC wafer fab, FATC packaging. Fully controllable specification cadence.
Shipped unbranded. Branded on request.
Both families ship without logo by default, preserving full supply-chain flexibility. Custom OEM mark printing on wafer or package is available — your brand, our qualification envelope.